DuPont Unveils Pyralux® ML Laminate Series, Offering High Thermal Management for Extreme Environments
09 4월 2024 - 10:00PM
DuPont today introduced the DuPont™ Pyralux® ML Series of
double-sided metal-clad laminates, a unique addition to its
extensive family of Pyralux® laminates for flexible and rigid-flex
printed circuit boards (PCBs). Developed for optimal thermal
management, these laminates are an ideal solution for
high-reliability markets such as aerospace, defense, electric
vehicles (EV), artificial intelligence (AI) related networking and
other electronic devices. The Pyralux® ML laminate series provides
exceptional performance in challenging environments, making it a
versatile and innovative solution for many different applications.
DuPont is exhibiting the innovative new laminates this week during
IPC APEX Expo, April 9-11, at the Anaheim Convention Center.
Laminates serve as the backbone for complex circuits built on
both rigid and flexible substrates. They provide mechanical
integrity to flex circuits while allowing designers the freedom to
fit circuits into the available footprint. The Pyralux® ML
double-sided metal-clad laminates have been engineered to address
the challenges of thermal management and provide optimized
performance and are ideally suited for flexible printed circuits,
sensors, heaters, and thermocouples deployed in high-reliability
applications that can benefit from unique metals with advanced
material performance.
Unlike other Pyralux® products, the Pyralux® ML laminate
contains metal alloy, such as copper-nickel (CuNi), featuring
Kapton® all-polyimide dielectric technology. The alloys provide
essential thermal resistance for heating, thermal conductivity to
improve the desired heat transfer, resistivity for higher heat
output, and thermoelectric properties as needed for the
application. Pyralux® ML laminates are available in a variety of
dielectric and foil types, thicknesses, and a range of metal
constructions. The laminates are fully compatible with most
conventional circuit fabrication processes, making them a versatile
product-development option for OEMs, designers and fabricators.
Pyralux® ML double-side clads are currently supplied in sheet form
and are being strategically rolled out by DuPont Electronics &
Industrial.
“At DuPont, we understand the critical role that laminates play
in supporting the complex circuits required by our customers. With
the launch of Pyralux® ML, we're proud to add another innovative
solution to our extensive family of laminates,” said Thean Ming
Tan, global business director, Laminate Products, DuPont
Interconnect Solutions. "Our relentless focus on optimizing thermal
management and advanced material performance is driven by the
evolving needs of industries such as aerospace, defense, and
industrial applications with high-performance, high-reliability
requirements. As leaders in materials science and engineering,
we're committed to developing new products and applications that
push the boundaries of what's possible, and we're honored to be a
part of such a vital industry.”
“Heightened demand for robust thermal-management capabilities
was the impetus for DuPont to leverage our engineering expertise in
creating this unique laminate material, which is not available
elsewhere,” stated Richard Wessel, applications technology manager,
DuPont Interconnect Solutions. “While fabricators have been
assembling laminates using base materials with similar properties,
the consistent appearance, strong bond strength, and predictable
performance of the Pyralux® brand are key benefits for customers
that choose Pyralux ML®.”
Pyralux® ML is just one of the innovative solutions that DuPont
is exhibiting at IPC APEX Expo. Other key products to be
featured:
- Electroplating chemistries, including
copper, nickel, chrome and silver options.
- One of the newest, Silveron™ GT-210
Durable Silver, is designed for electrical contact applications
requiring high conductivity and can tolerate high temperatures with
durability exceeding that of hard gold.
- Full range of Pyralux® laminated
circuit materials
- All-polyimide copper-clad flexible
laminates (CCLs), including Pyralux® HT and Pyralux® AP for rigid
flex and multilayer flex applications requiring high speed and
frequency and reliability
- Acrylic-based solutions, including
Pyralux® FR and Pyralux® LF CCLs, coverlays, bondplys and sheet
adhesives
- Riston® advanced dry film photoresists,
the industry standard for high yield, productivity, and ease of use
in imaging applications
- Interra® thin copper-clad laminates,
designed for use as embedded-capacitance materials in multilayer
rigid PCBs, offer industry-best mechanical strength, reliability
and capacitance stability
To learn more about these and other offerings, visit DuPont
Interconnect Solutions at IPC APEX Expo. The company will exhibit
and present Power Chats in the Insulectro Technology Village, Booth
3306, and will share Booth 4848 with Tritek Circuit Products.
About DuPont Electronics & IndustrialDuPont
Electronics & Industrial is a global supplier of new
technologies and performance materials serving the semiconductor,
circuit board, display, digital and flexographic printing,
healthcare, aerospace, industrial and transportation industries.
From advanced technology centers worldwide, teams of talented
research scientists and application experts work closely with
customers, providing solutions, products and technical service to
enable next-generation technologies.
About DuPont DuPont (NYSE: DD) is a global
innovation leader with technology-based materials, ingredients and
solutions that help transform industries and everyday life. Our
employees apply diverse science and expertise to help customers
advance their best ideas and deliver essential innovations in key
markets including electronics, transportation, construction, water,
health and wellness, food, and worker safety. More information can
be found at www.dupont.com/.
April 9, 2024
DuPont™, the DuPont Oval Logo, and all products, unless
otherwise noted, denoted with ™, ℠ or ® are trademarks, service
marks or registered trademarks of affiliates of DuPont de Nemours,
Inc.
For further information contact:
Janeen Hill+1 302-545-3068janeen.hill@dupont.com
A photo accompanying this announcement is available at
https://www.globenewswire.com/NewsRoom/AttachmentNg/e023c04c-d1da-47c3-a246-36d1426efe15
DuPont de Nemours (NYSE:DD)
과거 데이터 주식 차트
부터 4월(4) 2024 으로 5월(5) 2024
DuPont de Nemours (NYSE:DD)
과거 데이터 주식 차트
부터 5월(5) 2023 으로 5월(5) 2024