Breakthrough Digital Lithography Technology From Applied Materials and Ushio to Enable More Powerful Computing Systems for the AI Era
13 12월 2023 - 6:05AM
Applied Materials, Inc. and Ushio, Inc. today announced a strategic
partnership to accelerate the industry’s roadmap for heterogeneous
integration (HI) of chiplets into 3D packages. The companies are
jointly bringing to market the first digital lithography system
specifically designed for patterning the advanced substrates needed
in the Artificial Intelligence (AI) era of computing.
Rapidly growing AI workloads are driving the need for larger
chips with greater functionality. As the performance requirements
of AI outpaces traditional Moore’s Law scaling, chipmakers are
increasingly adopting HI techniques that combine multiple chiplets
in an advanced package to deliver similar or higher performance and
bandwidth as a monolithic chip. The industry needs larger package
substrates based on new materials such as glass that enable
extremely fine-pitch interconnects and superior electrical and
mechanical properties. The strategic partnership between Applied
and Ushio brings together two industry leaders to accelerate this
transition.
“Applied’s new Digital Lithography Technology (DLT) is the first
patterning system that directly addresses the needs of our
customers’ advanced substrate roadmaps,” said Dr. Sundar
Ramamurthy, Group Vice President and General Manager of HI, ICAPS
and Epitaxy, Semiconductor Products Group at Applied Materials. “We
are leveraging our unmatched expertise in large substrate
processing, the industry’s broadest portfolio of HI technologies,
and deep R&D resources to enable a new generation of innovation
in high-performance computing.”
“Ushio brings over 20 years of experience building lithography
systems for packaging applications, with more than four thousand
tools delivered worldwide,” said William F. Mackenzie, Group
Executive Officer and General Manager, Photonics Solutions Global
Business Unit at Ushio. “With this new partnership, we can
accelerate adoption of DLT through our scalable manufacturing
ecosystem and robust field-service infrastructure, and broaden our
portfolio to provide more solutions to the rapidly evolving
challenges in packaging technology.”
The new DLT system is the only lithography technology that can
achieve the resolution necessary for advanced substrate
applications while delivering throughput levels required for
high-volume production. With the ability to pattern less than
2-micron line widths, the system enables the highest area density
for chiplet architectures on any substrate, including wafers or
large panels made of glass or organic materials. The DLT system is
uniquely designed to solve unpredictable substrate warpage issues
and achieve overlay accuracy. Production systems have already been
shipped to multiple customers, and 2-micron patterning has been
demonstrated on glass and other advanced package substrates.
Applied pioneered the technology behind the DLT system and will
be responsible for R&D and definition of a scalable roadmap
together with Ushio to enable continued innovation in advanced
packaging to 1-micron line widths and beyond. Ushio will leverage
its mature manufacturing and customer-facing infrastructure to
accelerate adoption of DLT. Together, the partnership offers
customers the broadest portfolio of lithography solutions for
advanced packaging applications.
Forward-Looking StatementsThis press release
contains forward-looking statements, including those regarding
anticipated growth and trends in our businesses and markets,
industry outlooks and demand drivers, the benefits of the Digital
Lithography Technology (DLT) and the partnership between Applied
and Ushio, our market opportunities for advanced packaging
lithography and other technologies, and other statements that are
not historical facts. These statements and their underlying
assumptions are subject to risks and uncertainties and are not
guarantees of future performance.
Factors that could cause actual results to differ materially
from those expressed or implied by such statements include, without
limitation: the level of demand for the DLT; failure to realize the
anticipated benefits of the partnership between Applied and Ushio;
global economic, political and industry conditions; the
introduction of new and innovative technologies, and the timing of
technology transitions; our ability to develop, deliver and support
new products and technologies; market acceptance of existing and
newly developed products; our ability to obtain and protect
intellectual property rights in key technologies; our ability to
accurately forecast future results, market conditions, customer
requirements and business needs; and other risks and uncertainties
described in our SEC filings, including our recent Forms 10-K, 10-Q
and 8-K filed with the U.S. Securities and Exchange Commission. All
forward-looking statements are based on Applied and Ushio
management’s current estimates, projections and assumptions, and
neither company assumes any obligation to update them.
About Applied MaterialsApplied Materials, Inc.
(Nasdaq: AMAT) is the leader in materials engineering solutions
used to produce virtually every new chip and advanced display in
the world. Our expertise in modifying materials at atomic levels
and on an industrial scale enables customers to transform
possibilities into reality. At Applied Materials, our innovations
make possible a better future. Learn more at
www.appliedmaterials.com.
About UshioUshio Inc. (Head office: Tokyo, TSE:
6925) Established in 1964. The company manufactures and sells
lamps, lasers, light emitting diodes, and other light sources in
the ultraviolet, visible, and infrared bands of the spectrum along
with optical and imaging equipment incorporating these devices.
Numerous Ushio products in the industrial processes field, which
encompasses the manufacturing of semiconductors, flat panel
displays, electronic components and other products, and in the
visual imaging field, characterized by digital projectors,
illumination, and other products, have large market shares. In
recent years, Ushio’s operations have expanded to the life sciences
field, most notably medical applications and the environment.
https://www.ushio.co.jp/en/
Applied Materials Contacts:Ricky Gradwohl (U.S.
editorial/media) 408.235.4676Yuji Hotta (Japan editorial/media)
+81-3-6812-6820Michael Sullivan (financial community)
408.986.7977
Ushio Contacts:Corporate Communication
Department (Japan editorial/media) +81-3-5657-1017Shintaro Yabu
(U.S. editorial/media) 714.229.3189
Photos accompanying this announcement are available at:
https://www.globenewswire.com/NewsRoom/AttachmentNg/815b368c-75a3-4ab1-8a14-76971688ca86
https://www.globenewswire.com/NewsRoom/AttachmentNg/7f5c3a22-41e5-4b3b-8842-7923cb4de0a2
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