Mentor Graphics and TSMC Address Advanced Node Fill Requirements Using Calibre SmartFill
14 9월 2011 - 10:00PM
Business Wire
Mentor Graphics Corporation (NASDAQ: MENT) today announced a
collaboration with TSMC to support SmartFill functionality in the
Calibre® YieldEnhancer product for TSMC’s manufacturing processes
starting at 65nm. The analysis and automatic filling capabilities
of the SmartFill solution allow designers to achieve IC fill
constraints with minimal impact on circuit performance in a single
pass without manual customization or modification.
“We have worked closely with Mentor to create an effective fill
solution for advanced nodes. SmartFill is designed to handle the
new fill requirements of our most advanced process technologies,”
said Suk Lee, director of Design Infrastructure Marketing at TSMC.
“Our collaboration with Mentor cell-based fill is particularly
important because it makes writing advanced node fill decks easier,
while reducing runtime and output file size by placing cells rather
than individual polygons on multiple layers.”
New Capabilities for Advanced Fill Requirements
SmartFill integrates the full range of the Calibre analysis
engines into the fill process to achieve fully optimized fill
without manual iterations. It provides advanced capabilities such
as multi-layer fill shapes and the ability to add fill cells, which
are automatically inserted into a layout based on analysis of the
design.
SmartFill uses continuous, multi-dimensional functions in place
of linear pass-fail conditions, enabling finer resolution of
complex fill algorithms that cannot be performed with
single-dimensional design rules alone. This allows customers to
optimize for multiple factors such as density and perimeter.
Since SmartFill employs standard Calibre interfaces, it fits
seamlessly into the customer’s existing design environment. It
supports timing-aware fill with back annotation of fill shapes into
all industry-leading design databases to enable final timing
verification. It also allows customers to provide a list of
critical nets that receive special treatment during the fill
procedure.
“The sophistication of filling strategies has increased
dramatically over the last couple of nodes due to the increasing
complexity in both manufacturing and design aspects impacted by
fill,” said Joseph Sawicki, vice president and general manager of
the Design-to-Silicon division at Mentor Graphics. “SmartFill
provides designers with a solution that allows them to generate
fill that has been optimized to their specific design and cycle
time needs, while still achieving TSMC’s advanced fill
requirements.”
About Mentor Graphics
Mentor Graphics Corporation (NASDAQ: MENT) is a world leader in
electronic hardware and software design solutions, providing
products, consulting services and award-winning support for the
world’s most successful electronic, semiconductor and systems
companies. Established in 1981, the company reported revenues over
the last 12 months of about $915 million. Corporate headquarters
are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon
97070-7777. World Wide Web site: http://www.mentor.com/.
(Mentor Graphics and Calibre are registered trademarks of Mentor
Graphics Corporation. All other company or product names are the
registered trademarks or trademarks of their respective
owners.)
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