Intel and Cadence Expand Partnership to Enable Best-in-Class SoC Design on Intel’s Advanced Processes
21 2월 2024 - 12:45AM
Business Wire
Highlights:
- Multiyear agreement to enable best-in-class system-on-chips
(SoCs) for the AI, high performance computing (HPC) and mobile
markets.
- Joint development on customized intellectual property (IP),
design flows and design techniques for Intel’s most advanced
RibbonFET processes on Intel 18A and beyond.
- Further strengthening of strong existing partnership to advance
Intel’s IDM 2.0 strategy, creating a more robust offering for new
and existing Intel Foundry Services (IFS) customers.
Intel Foundry Services (IFS) and Cadence Design Systems, Inc.
(Nasdaq: CDNS) announced they have expanded their partnership and
entered into a multiyear strategic agreement to jointly develop a
portfolio of key customized IP, optimized design flows and
techniques for Intel 18A technology featuring RibbonFET
gate-all-around transistors and PowerVia backside power delivery.
Joint customers will be able to accelerate their SoC project
schedules on process nodes from Intel 18A and beyond while
optimizing for performance, power, area, bandwidth and latency for
demanding AI, HPC and premium mobile applications.
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“We furthered our partnership with Intel Foundry Services
through a significant strategic multiyear agreement to provide
design software and leading IP at multiple Intel advanced nodes,
thereby advancing Intel’s IDM 2.0 strategy and accelerating mutual
customer success,” said Anirudh Devgan, president and chief
executive officer at Cadence.
“We’re very excited to expand our partnership with Cadence to
grow the IP ecosystem for IFS and provide choice for customers,”
said Stuart Pann, Intel senior vice president and general manager
of IFS. “We will leverage Cadence’s world-class portfolio of
leading IP and advanced design solutions to enable our customers to
deliver high-volume, high-performance and power-efficient SoCs on
Intel’s leading-edge process technologies.”
Fast-growing market segments, such as AI/ML, HPC and premium
mobile computing, require the latest standards in IP to take
advantage of advanced packaging and silicon process technologies.
Cadence’s leading-edge implementations of trailblazing standards,
such as advanced memory protocols, PCI Express, UCI Express and
others for these key segments, enable joint customers to achieve
scalable, high-performance designs that accelerate their time to
market in IFS’ most advanced silicon technologies and 3D-IC
packaging capabilities.
Building a world-class foundry business is key to Intel’s IDM
2.0 strategy, and this agreement strengthens IFS’ offerings by
making an additional portfolio of essential design tools, flows and
interface IP available for foundry customers. It builds on Intel’s
engagement with other industry-leading IP providers as it continues
to grow the IP ecosystem for IFS customers.
About Intel
Intel (Nasdaq: INTC) is an industry leader, creating
world-changing technology that enables global progress and enriches
lives. Inspired by Moore’s Law, we continuously work to advance the
design and manufacturing of semiconductors to help address our
customers’ greatest challenges. By embedding intelligence in the
cloud, network, edge and every kind of computing device, we unleash
the potential of data to transform business and society for the
better. To learn more about Intel’s innovations, go to
newsroom.intel.com and intel.com.
About Cadence
Cadence is a pivotal leader in electronic design, building upon
more than 30 years of computational software expertise. The company
applies its underlying Intelligent System Design strategy to
deliver software, hardware and IP that turn design concepts into
reality. Cadence customers are the world’s most innovative
companies, delivering extraordinary electronic products from chips
to boards to systems for the most dynamic market applications,
including consumer, hyperscale computing, 5G communications,
automotive, mobile, aerospace, industrial and healthcare. For nine
years in a row, Fortune magazine has named Cadence one of the 100
Best Companies to Work For. Learn more at cadence.com.
© 2024 Cadence Design Systems, Inc. All rights reserved
worldwide. Cadence, the Cadence logo and the other Cadence marks
found at www.cadence.com/go/trademarks are trademarks or registered
trademarks of Cadence Design Systems, Inc. PCI Express and PCIe are
registered trademarks of PCI-SIG. Universal Chiplet Interconnect
Express and UCIe are trademarks of the UCIe Consortium. All other
trademarks are the property of their respective owners.
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Cadence Newsroom 408-944-7039 newsroom@cadence.com
Robin Holt 1-503-616-1532 robin.holt@intel.com
Cadence Design Systems (NASDAQ:CDNS)
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