DUIVEN, Netherlands, Nov. 8 /PRNewswire-FirstCall/ -- BE Semiconductor Industries N.V. ("the Company" or "Besi") (Nasdaq: BESI; Euronext: BESI), a leading manufacturer of assembly equipment for the semiconductor industry, today announced that the Company is scheduled to present at CA Cheuvreux's European Mid Cap Conference. Richard Blickman, President and CEO, will present at the conference. The presentation will not be webcast. Place: Mandarin Oriental Hotel, New York Time: 8:30 a.m. ET, Thursday, November 16, 2006 About BE Semiconductor Industries N.V. BE Semiconductor Industries N.V. designs, develops, manufactures, markets and services die sorting, flip chip and multi-chip die bonding, packaging and plating equipment for the semiconductor industry's assembly operations. Its customers consist primarily of leading U.S., European, Asian, Korean and Japanese semiconductor manufacturers and subcontractors which utilize its products for both array connect and conventional leadframe manufacturing processes. Contacts: Richard W. Blickman Cor te Hennepe President & CEO Director of Finance Tel. (31) 26 319-4500 Tel. (31) 26 319-4500 David Pasquale The Ruth Group Tel. (1) 646 536-7006 DATASOURCE: BE Semiconductor Industries N.V. CONTACT: Richard W. Blickman, President & CEO, or Cor te Hennepe, Director of Finance, both for BE Semiconductor Industries N.V., +31-26-319-4500, ; or David Pasquale of The Ruth Group, +1-646-536-7006, Web site: http://www.besi.nl/

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