3DIC Compiler Co-Design and Analysis Solution
Combined with Synopsys IP Accelerates Heterogeneous Integration for
Intel Foundry's EMIB Technology
Highlights
- Synopsys AI-driven multi-die reference flow now extended for
Intel Foundry's EMIB advanced packaging technology accelerates
quality-of-results for heterogeneous integration
- Synopsys 3DIC Compiler, a unified exploration-to-signoff
platform, supports multi-die co-design of Intel Foundry's EMIB
technology
- Synopsys IP for multi-die design supports efficient die-to-die
connectivity and high memory bandwidth requirements
SUNNYVALE, Calif., June 24,
2024 /PRNewswire/ -- Synopsys,
Inc. (Nasdaq: SNPS) today announced the availability of
its production-ready multi-die reference flow, powered by
Synopsys.ai™ EDA suite, and Synopsys IP for Intel Foundry's
embedded multi-die interconnect bridge (EMIB) advanced packaging
technology. The optimized reference flow provides a unified
co-design and analysis solution, enabled by Synopsys 3DIC Compiler
to accelerate exploration and development of multi-die designs at
all stages from silicon to systems. In addition, Synopsys
3DSO.ai is natively integrated with Synopsys 3DIC Compiler,
enabling optimization for signal, power and thermal integrity with
unparalleled productivity gains and maximum system performance.
![Synopsys (PRNewsfoto/Synopsys) Synopsys (PRNewsfoto/Synopsys)](https://mma.prnewswire.com/media/2186690/Synopsys_Logo_Purple.jpg)
"As bandwidth demands soar to new heights, companies are turning
to multi-die designs at an accelerated pace to achieve greater
levels of processing power and performance for their AI and
high-performance computing applications," said Sanjay Bali, vice president of strategy and
product management for the Synopsys EDA Group. "Our long-standing
and deep collaboration with Intel Foundry, resulting in a
production-ready AI-driven multi-die reference flow for EMIB
technology, provides our mutual customers with a comprehensive
solution that helps them develop their billion- to
trillion-transistor multi-die systems."
"Addressing the design and packaging complexities of multi-die
architectures requires a holistic approach to solving the thermal,
signal integrity, and interconnect challenges," said Suk Lee, VP & GM of Ecosystem Technology
Office, at Intel Foundry. "Intel Foundry's manufacturing and
advanced packaging technologies, combined with Synopsys' certified
multi-die reference flow and trusted IP, provides designers with a
comprehensive and scalable solution for fast heterogeneous
integration using the Intel Foundry's EMIB technology."
AI-Driven EDA Reference Flow and IP for Multi-Die
Designs
Synopsys offers a comprehensive and scalable
multi-die solution for fast heterogeneous integration. The
solution, from silicon to systems, enables early architecture
exploration, rapid software development and system validation,
efficient die-package co-design, robust die-to-die connectivity,
and improved manufacturing and reliability. Adopted by multiple
leading customers, Synopsys 3DIC Compiler, a key
component of the multi-die solution, is integrated
with Ansys® RedHawk-SC Electrothermal™ multiphysics
technology, to address the power and thermal signoff
critical for 2.5D/3D multi-die designs. In addition, the
solution maximizes system performance and quality of results at a
rapid pace with Synopsys 3DSO.ai, an autonomous
AI-driven optimization engine for 2.5D and 3D multi-die
designs.
Synopsys is developing IP for Intel Foundry process
technologies, providing the interconnects needed to build multi-die
packages with reduced integration risk and accelerated
time-to-market. The combination of Synopsys IP and Synopsys 3DIC
Compiler can enable up to 30% reduction in effort and 15%
improvement in quality of results (as measured by margin) compared
to traditional manual flows by automating routing, interposer
studies, and signal integrity analysis.1
Availability and Resources
The reference flow is available now from either Intel
Foundry or Synopsys.
- Learn more about the Synopsys Multi-Die Solution:
https://www.synopsys.com/multi-die-system.html
- Learn more about Synopsys IP:
https://www.synopsys.com/designware-ip.html
- Intel 18A collaboration announcement:
https://news.synopsys.com/2024-02-21-Synopsys-and-Intel-Foundry-Accelerate-Advanced-Chip-Designs-with-Synopsys-IP-and-Certified-EDA-Flows-for-Intel-18A-Process
About Synopsys
Catalyzing the era of pervasive
intelligence, Synopsys, Inc.
(Nasdaq: SNPS) delivers trusted and
comprehensive silicon to systems design solutions, from electronic
design automation to silicon IP and system
verification and validation. We partner closely with semiconductor
and systems customers across a wide range of industries to maximize
their R&D capability and productivity, powering innovation
today that ignites the ingenuity of tomorrow. Learn more
at www.synopsys.com.
Editorial Contact
Kelli Wheeler
Synopsys, Inc.
(650)
584-5000
corp-pr@synopsys.com
1 Benchmark test results as of February 2024 by Synopsys comparing manual and
automated flows using Synopsys IP and Synopsys 3DIC
Compiler.
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SOURCE Synopsys, Inc.