REPAY to Attend the Wolfe Research FinTech Forum
21 2월 2024 - 10:30PM
Business Wire
Repay Holdings Corporation (NASDAQ: RPAY) (“REPAY” or the
“Company”), a leading provider of vertically-integrated payment
solutions, today announced that the Company will attend the Wolfe
Research FinTech Forum in New York, NY on Thursday, March 14,
2024.
Darin Horrocks, EVP of Business Payments, will be participating
in a panel discussion titled, “B2B Payments - Cash is King but
Digital Rules; Exiting the Paper Check Dark Ages”. In addition, the
Company will be hosting investor meetings. If you would like to
request a meeting, please reach out to the Wolfe conference
team.
About REPAY
REPAY provides integrated payment processing solutions to
verticals that have specific transaction processing needs. REPAY’s
proprietary, integrated payment technology platform reduces the
complexity of electronic payments for clients, while enhancing the
overall experience for consumers and businesses.
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version on businesswire.com: https://www.businesswire.com/news/home/20240221641106/en/
Investor Relations for REPAY: ir@repay.com
Media Relations for REPAY: Kristen Hoyman khoyman@repay.com
Repay (NASDAQ:RPAY)
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부터 4월(4) 2024 으로 5월(5) 2024
Repay (NASDAQ:RPAY)
과거 데이터 주식 차트
부터 5월(5) 2023 으로 5월(5) 2024
