Latest Design IP Report from IPNest ranks Ceva
#1 in Wireless Interface IP Revenue for 2023 with 67% market share,
based on its extensive portfolio of Bluetooth, Wi-Fi, UWB and
802.15.4 IPs
ROCKVILLE, Md., Aug. 13,
2024 /PRNewswire/ -- Ceva, Inc. (NASDAQ: CEVA),
the leading licensor of silicon and software IP that enables Smart
Edge devices to connect, sense and infer data more reliably and
efficiently, today announced that it has continued its hold on the
#1 position in the wireless connectivity IP market according
to IPNest's latest Design IP Report, commanding a dominant 67%
market share of IP revenues in 2023. The Ceva-Waves wireless
connectivity IP portfolio encompasses the most adopted
standards-based wireless connectivity IPs, including Bluetooth,
Wi-Fi, UWB and 802.15.4, which can be licensed individually or as
multi-standard solutions via the Ceva-Waves-Links family. In
addition to enabling high-performance, reliable and low power
connectivity, its wireless portfolio is a linchpin in the company's
expansion into other IoT applications that require innovative edge
AI processing and sensing capabilities.
Ceva's wireless connectivity IP leadership began over a
decade ago, starting with Bluetooth and expanding to include Wi-Fi,
802.15.4 and most recently UWB. With the emergence of the Internet
of Things, almost every electronic device around us has become
connected, leading to a huge push for semiconductor companies to
integrate wireless connectivity into their MCU and SoC designs. A
scarcity of wireless design expertise coupled with strict cost,
power and time-to-market constraints has led to strong demand for
Ceva's wireless connectivity IPs, culminating in more than 1.3
billion devices in 2023 sold worldwide powered by Ceva wireless
connectivity IP. In Bluetooth alone, Ceva estimates its worldwide
Bluetooth IoT market share in 2023 was 35%*, and TWS earbuds market
share was 45%**, excluding Apple. For Wi-Fi 6, with more than 40
licensees to date, Ceva forecasts to capture 25-30% of Wi-Fi IoT
market share within 2 years. More recently, the company began to
license its next-generation Ceva-Waves Bluetooth Channel Sounding,
Wi-Fi 7, UWB 2.0 and 802.15.4 IPs, which will drive further market
share growth for Ceva.
"For many years, Ceva has been the dominant supplier of wireless
interface IP to the semiconductor industry, with a strong focus on
low power innovation and constantly being first to market with the
latest standards," said Dr. Eric
Esteve, Principal Analyst at IPnest. "As the IP vendor with
the broadest range of wireless connectivity IPs in an increasingly
connected world, their portfolio provides proven solutions for the
integration of multi-standard wireless connectivity into chip
designs, faster and with lower risk."
Iri Trashanski, Chief Strategy Officer at Ceva, added: "Wireless
connectivity is a fundamental building block of every smart edge
device and forms the basis of our strategy at Ceva to enable any
device to connect, sense and infer data more reliably and
efficiently. IPNest's latest Design IP Report reinforces our
incredible track record of successful implementations of wireless
connectivity that powers billions of devices, established through
partnerships with many of the world's leading semiconductor
companies and OEMs. Our customers rely on our proven and reliable
IP to provide secure and high performance connectivity today and in
future generations of their products. As the devices we connect
become increasingly intelligent, our portfolio of sensing IPs and
edge AI NPUs perfectly complement our wireless IPs, and offer our
customers a single source and unified approach for their smart edge
product roadmaps."
*Market share based on ABI Research Bluetooth Market Tracker
– Q2'24, data excluding mobile shipments, and; Ceva internal
data.
**Market share based on Ceva customer market share
estimates from 52audio, Morgan Stanley Research as of Sept
'23.
About Ceva, Inc.
At Ceva, we are passionate about
bringing new levels of innovation to the smart edge. Our wireless
communications, sensing and Edge AI technologies are at the heart
of some of today's most advanced smart edge products. From
Bluetooth, Wi-Fi, UWB and 5G platform IP for ubiquitous,
robust communications, to scalable Edge AI NPU IPs, sensor fusion
processors and embedded application software that make devices
smarter, we have the broadest portfolio of IP to connect, sense and
infer data more reliably and efficiently. We deliver differentiated
solutions that combine outstanding performance at ultra-low power
within a very small silicon footprint. Our goal is simple – to
deliver the silicon and software IP to enable a smarter, safer, and
more interconnected world. This philosophy is in practice today,
with Ceva powering more than 18 billion of the world's most
innovative smart edge products from AI-infused smartwatches, IoT
devices and wearables to autonomous vehicles and 5G mobile
networks.
Our headquarters are in Rockville,
Maryland with a global customer base supported by operations
worldwide. Our employees are among the leading experts in their
areas of specialty, consistently solving the most complex design
challenges, enabling our customers to bring innovative smart edge
products to market.
Ceva: Powering the Smart Edge™
Visit us at www.ceva-ip.com and follow us on LinkedIn, X,
YouTube, Facebook, and Instagram.
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SOURCE Ceva, Inc.