STMicroelectronics introduces first STM32-ready wireless IoT modules leveraging collaboration with Qualcomm
11 12월 2024 - 5:00PM
STMicroelectronics introduces first
STM32-ready wireless IoT modules leveraging collaboration with
Qualcomm
WiFi6/Bluetooth 5.3/Thread ST67W611M1 modules
accelerate development and boosts flexibility to deliver advanced
consumer and industrial IoT solutions
Geneva, Switzerland, December 11, 2024 –
STMicroelectronics (NYSE: STM), a global semiconductor
leader serving customers across the spectrum of electronics
applications, has introduced the first product of its strategic
collaboration with Qualcomm Technologies to simplify development of
next-generation wireless solutions for industrial and consumer IoT
applications. The collaboration aims to deliver initially IoT
modules leveraging ST’s powerful STM32 ecosystem and Qualcomm
Technologies’ leading wireless connectivity solutions.
The first of these modules, the ST67W611M1, contains a Qualcomm®
QCC743 multiprotocol connectivity system-on-a-chip (SoC),
pre-loaded with Wi-Fi6, Bluetooth 5.3 qualified, and Thread combo,
made easy to integrate with any STM32 microcontroller (MCU) or
microprocessor (MPU). The module will support Matter protocol over
Wi-Fi for future-proof connectivity, making the STM32 portfolio
seamlessly accessible to the Matter ecosystem. Aiding the system
integration, the module also contains 4Mbyte Flash for code and
data storage, and a 40MHz crystal. There is also an integrated PCB
antenna or micro RF (uFL) connector for an external antenna.
“Our collaboration delivers multiple advantages for the large
community that leverage the STM32 family in their embedded
systems,” said Remi El-Ouazzane, President, Microcontrollers,
Digital ICs and RF Products Group (MDRF) at STMicroelectronics.
“Qualcomm’s expertise in highly influential and widely used
wireless connectivity technologies is now at product developers’
fingertips and combines with the powerful software, tools, features
and project acceleration offered by the STM32 development
ecosystem.”
“This is just the beginning of our mission, which we expect to
deliver many further successes enabling new and advanced edge
processing applications,” said Rahul Patel, Group General Manager,
Connectivity, Broadband and Networking Business Unit, Qualcomm
Technologies, Inc. “We look forward to continuing our collaboration
with STMicroelectronics to bring more unparalleled connected
experiences with Wi-Fi, Bluetooth, AI, 5G and more.”
Advanced hardware security is built in, with hardware
cryptographic accelerators, as well as services including secure
boot and secure debug, reaching PSA Certified Level 1 protection.
The module is self-contained and pre-certified according to
mandatory specifications, requiring no RF design expertise from the
user to create a working solution. Highly integrated in a 32-lead
LGA package, it is ready to place on the board and permits simple,
low-cost PCB designs with as few as two layers.
The ST67W611M1 leverages the STM32 ecosystem, which contains
over 4,000 commercial part numbers, powerful STM32Cube tools and
software, and enhancements that boost edge AI development. AI
enhancements include the recently introduced STM32N6 MCUs, which
contain ST’s Neural-ART Accelerator, and the ST Edge AI Suite that
provides an AI Model Zoo and STM32Cube.AI and NanoEdge AI
optimization tools.
The modules are designed to be quickly and seamlessly integrated
with any STM32 microcontroller or STM32 microprocessor, which offer
flexible options for performance, price, and power across a broad
spectrum. The MCUs available range from cost- and power-sensitive
devices containing the Arm® Cortex®-M0+ core to devices containing
high performing cores such as Cortex-M4 and Cortex-A7 in the
STM32MP1/2 MPUs.
Samples of the ST67W611M1 are available, with OEM availability
in Q1 2025, with broader availability in Q2 2025. To request
samples and pricing options please contact your local ST sales
office.
For more information, please go to www.st.com/st67wYou can also
refer to the press release of October 2024: STMicroelectronics and
Qualcomm enter strategic collaboration in wireless IoT
STM32 is a registered and/or unregistered trademark of
STMicroelectronics International NV or its affiliates in the EU
and/or elsewhere. In particular, STM32 is registered in the US
Patent and Trademark Office.
Qualcomm and Snapdragon products mentioned within this press
release are offered by Qualcomm Technologies, Inc. and/or its
subsidiaries. Qualcomm and Snapdragon are trademarks or registered
trademarks of Qualcomm Incorporated.
About STMicroelectronicsAt ST, we are over
50,000 creators and makers of semiconductor technologies mastering
the semiconductor supply chain with state-of-the-art manufacturing
facilities. An integrated device manufacturer, we work with more
than 200,000 customers and thousands of partners to design and
build products, solutions, and ecosystems that address their
challenges and opportunities, and the need to support a more
sustainable world. Our technologies enable smarter mobility, more
efficient power and energy management, and the wide-scale
deployment of cloud-connected autonomous things. We are committed
to achieving our goal to become carbon neutral on scope 1 and 2 and
partially scope 3 by 2027. Further information can be found at
www.st.com.
For Press Information Contact:
INVESTOR RELATIONSJérôme RamelEVP Corporate
Development & Integrated External CommunicationTel:
+41.22.929.59.20jerome.ramel@st.com
MEDIA RELATIONSAlexis BretonCorporate External
CommunicationsTel: +33.6.59.16.79.08alexis.breton@st.com
- P4666S -- Dec 11 2024 -- ST67W611 Qualcomm module_FINAL FOR
PUBLICATION
- P4666S -- Dec 11 2024 -- ST67W611 Qualcomm module_IMAGE
ST Microelectronics (EU:STMPA)
과거 데이터 주식 차트
부터 11월(11) 2024 으로 12월(12) 2024
ST Microelectronics (EU:STMPA)
과거 데이터 주식 차트
부터 12월(12) 2023 으로 12월(12) 2024
