DRUNEN, Netherlands, July 18 /PRNewswire-FirstCall/ -- BE Semiconductor Industries N.V. ("the Company" or "Besi") (Nasdaq: BESI; Euronext), a leading manufacturer of assembly equipment for the semiconductor industry, will report operating results for the three months ended June 30, 2006, on Thursday, July 20, 2006 at 8:30 a.m. Continental European time (2:30 a.m. New York time). Besi will host a conference call on Thursday, July 20, 2006 at 4:00 p.m. CET (3:00 p.m. London time, 10:00 a.m. New York time). Interested participants may call (31) 20 531 5856 for the teleconference. A replay will be available from approximately one hour after the end of the call through Thursday, July 27, 2006. To access the replay, please dial (31) 70 315 4300 and use the passcode 124 507#. About BE Semiconductor Industries N.V. BE Semiconductor Industries N.V. designs, develops, manufactures, markets and services die sorting, flip chip and multi-chip die bonding, packaging and plating equipment for the semiconductor industry's assembly operations. Its customers consist primarily of leading U.S., European, Asian, Korean and Japanese semiconductor manufacturers and subcontractors which utilize its products for both array connect and conventional leadframe manufacturing processes. Contacts: Richard W. Blickman Cor te Hennepe President & CEO Director of Finance Tel. (31) 416 384345 Tel. (31) 416 384345 David Pasquale The Ruth Group Tel. (1) 646 536 7006 DATASOURCE: BE Semiconductor CONTACT: Richard W. Blickman, President & CEO, +1-31-416-384345, , or Cor te Hennepe, Director of Finance, +1-31-416-384345, , both of BE Semiconductor; David Pasquale of The Ruth Group, +1-646-536-7006, , for BE Semiconductor Web site: http://www.besi.nl/

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