DRUNEN, Netherlands, May 2 /PRNewswire-FirstCall/ -- BE Semiconductor Industries N.V. ("the Company" or "Besi") (Nasdaq: BESI; Euronext: BESI), a leading manufacturer of assembly equipment for the semiconductor industry, today announced that the Company is scheduled to present at Piper Jaffray's 8th Annual Hardware and Communications Conference. Richard Blickman, President and CEO, will present at the conference. The Company will webcast the presentation live on its website at http://www.besi.com/. Place: New York Palace Hotel, New York Time: 3:20 p.m. ET, Thursday, May 11, 2006 Web Access: http://www.besi.com/ About BE Semiconductor Industries N.V. BE Semiconductor Industries N.V. designs, develops, manufactures, markets and services die sorting, flip chip and multi-chip die bonding, packaging and plating equipment for the semiconductor industry's assembly operations. Its customers consist primarily of leading U.S., European, Asian, Korean and Japanese semiconductor manufacturers and subcontractors which utilize its products for both array connect and conventional leadframe manufacturing processes. Contacts: Richard W. Blickman Cor te Hennepe President & CEO Director of Finance Tel. (31) 416 384345 Tel. (31) 416 384345 David Pasquale The Ruth Group Tel. (1) 646 536-7006 DATASOURCE: BE Semiconductor Industries N.V. CONTACT: Richard W. Blickman, President & CEO, (31) 416 384345, or Cor te Hennepe, Director of Finance, (31) 416 384345, both of BE Semiconductor Industries N.V., ; or David Pasquale of The Ruth Group, +1-646-536-7006, or Web site: http://www.besi.nl/

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