Sony Corp Sony increases production capacity for stacked CMOS image sensors
23 7월 2014 - 7:00PM
UK Regulatory
TIDMSON
Sony Corporation1-7-1 Konan,Minato-ku, Tokyo108-0075, Japan
No. 14-070EJuly 23, 2014
Sony increases production capacity for stacked CMOS image
sensors
- Reinforcing supply capability for products such as smartphones
-
July 23, 2014, Tokyo, Japan - Sony Corporation ("Sony") today
announced that it plans to invest in Sony Semiconductor
Corporation's Nagasaki Technology Center ("Nagasaki TEC") and
Kumamoto Technology Center ("Kumamoto TEC") from the second half of
the fiscal year ending March 31, 2015 ("FY14") through the first
half of the fiscal year ending March 31, 2016 ("FY15"), to increase
its production capacity for stacked CMOS image sensors.*1
This investment is primarily intended to reinforce Nagasaki
TEC's layering process*2 production capabilities, as well as
Kumamoto TEC's mastering process*3 facilities.
On January 29, 2014, Sony announced its plans to establish and
invest in Yamagata Technology Center ("Yamagata TEC") as a facility
mainly conducting the mastering process. The current investment is
expected to enable Sony to complete subsequent stages of
production, including the layering process, at Nagasaki TEC on
semiconductor chips that have undergone the mastering process at
Yamagata TEC, providing Sony with a fully integrated production
system for stacked CMOS image sensors.
This investment forms part of Sony's mid- to long-term plan to
increase its total production capacity for image sensors to
approximately 75,000 wafers per month,*4 and is expected to
increase the current capacity of approximately 60,000 wafers per
month to approximately 68,000 wafers per month in August 2015.
Stacked CMOS image sensors deliver superior image quality and
advanced functionality, together with compact size. Demand for
these image sensors is anticipated to further increase,
particularly within the expanding market for mobile devices such as
smartphones and tablets. Sony intends to bolster its manufacturing
capacity for stacked CMOS image sensors, and further strengthen its
integrated supply operations, and to thereby reinforce its leading
market position.
The total investment amount is expected to be approximately 35
billion yen, comprising approximately 9 billion yen (Nagasaki TEC:
approximately 3 billion, Kumamoto TEC: approximately 6 billion) to
be carried out in FY14, and approximately 26 billion yen (Nagasaki
TEC) to be carried out in FY15. Of this, the amount to be invested
in FY14 (approximately 9 billion yen) was included in the forecast
of capital expenditure for semiconductors in the current fiscal
year (approximately 65 billion yen) announced on May 14, 2014.
*1: CMOS image sensors layer, in a stacked structure, the pixel section,
containing back-illuminated structure pixels, onto chips containing
the circuit for signal processing, in contrast
to the supporting substrates
used in conventional back-illuminated CMOS image sensors.
*2: The layering process refers to the layering semiconductor
chips containing back-illuminated
structure pixels with semiconductor chips containing
the circuit for signal processing.
*3: The mastering process refers to the manufacture of photodiodes
and wiring processes for stacked CMOS image sensors.
*4: This total production capacity (300mm wafer basis)
includes the output of foundry operations to
which Sony outsources a part of the manufacturing
process. For the purposes of calculating
total production capacity, the capacity of 200mm
wafer production lines in Kagoshima Technology
Center and Nagasaki TEC is converted to the new
300mm wafer production capacity basis.
Investment Overview
Purpose of Investment: Increase production capacity to meet growing
demand for stacked CMOS image sensors
Investment site: Sony Semiconductor Corporation,
Nagasaki Technology
Center (Isahaya-shi, Nagasaki
Prefecture), Kumamoto Technology Center
(Kikuchi-gun, Kumamoto Prefecture)
Investment details: - Nagasaki TEC Fab 2 facility: installing
new equipment to manufacture
CMOS image sensors (primarily from
layering process onwards)
- Kumamoto TEC Fab 2 facility:
installing new equipment to
manufacture CMOS image sensors
(mastering process)
Investment amount: Approximately 35 billion yen (planned amount)
<Details of investment> - Approximately 9 billion yen (Nagasaki TEC:
approximately 3 billion, Kumamoto
TEC: approximately 6 billion) scheduled
to be carried out in FY14
- Approximately 26 billion yen (Nagasaki TEC)
scheduled to be carried out in FY15
Outline of Sony Semiconductor Corporation
(1) Head office: 4000-1 Ooaza-haramizu, Kikuyou-machi, Kikuchi-gun, Kumamoto, Japan
(2) Date of Establishment: April 1, 2001
(3) Representative: Toshiro Kurusu, President and Representative Director
(4) Capital: 24.25 billion yen (wholly owned by Sony Corporation)
(5) Production sites: Kagoshima, Oita, Nagasaki, Kumamoto, Shiroishi-Zao (Miyagi), Higashiura (Aichi) and Yamagata (as of July 2014)
(6) Number of employees: Approximately 7,400 (including contract and temporary employees) as of April 2014
(7) Business activities: Development, design and production of semiconductors
(Reference) Outline of Sony Semiconductor Corporation Nagasaki Technology Center
(1) Location: 1883-43, Tsukuba-machi, Isahaya-shi, Nagasaki, Japan
(2) Date of Establishment: December 4, 1987
(3) Representative: Yoshihiro Yamaguchi, President and Corporate Vice President, Nagasaki TEC
(4) Site area: 194,000?
(5) Floor area: 221,000?
(6) Main products: CMOS image sensors and MOS LSIs
(Reference) Outline of Sony Semiconductor Corporation Kumamoto Technology Center
(1) Location: 4000-1 Ooaza-haramizu, Kikuyou-machi, Kikuchi-gun, Kumamoto, Japan
(2) Date of Establishment: October 1, 2001
(3) Representative: Hiromi Suzuki, President and Corporate Vice President, Kumamoto TEC
(4) Site area: 266,000?
(5) Floor area: 197,000?
(6) Main products: CMOS image sensors, CCD image sensors, micro-display devices
The full press release, including related images, can be viewed
at the following URL:
http://www.sony.net/SonyInfo/News/Press/201407/14-070E/
This information is provided by Business Wire
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