POET
Announces Design Win and Collaboration with Foxconn Interconnect
Technology
for
High-speed AI Systems
Toronto, Ontario, May 14, 2024 -- InvestorsHub NewsWire
-- POET
Technologies Inc. ("POET" or
the "Company")
(TSX Venture: PTK;
NASDAQ:
POET), the designer and developer of the POET Optical
Interposer™ and
Photonic Integrated Circuits (PICs) for the data center,
telecommunication and artificial intelligence
markets, today
announced that
Foxconn Interconnect Technology ("FIT"), a market leader of
interconnect solutions for communication infrastructure and several
other large, high-growth markets, has selected POET's optical
engines, which are silicon photonics integrated circuits (Silicon
PIC), for its 800G and 1.6T optical transceiver modules.
POET
and FIT have entered into a collaboration to develop 800G and 1.6T
pluggable optical transceiver modules using POET optical engines
with an aim to address the growth in demand from cutting-edge AI
applications and high-speed data center networks. As part of the
collaboration, POET will develop and supply its silicon photonics
integrated circuit optical engines based on the patented POET
Optical Interposer™ technology and FIT, one of the world's leading
manufacturers of interconnect technologies, will design and supply
the high-speed pluggable optical transceivers for delivery to some
of the largest end customers in the world.
"The
growth in demand from emerging applications such as artificial
intelligence and machine learning requires continuous innovation to
keep pace with power and cost requirements," said Joseph Wang, CTO
at FIT. "We are excited to partner with POET on this development.
POET's hybrid-integration platform technology will enable us to use
best-of-breed components and ramp to high volume at a much faster
pace and in a cost-efficient manner."
"POET's
vision is to 'semiconductorize' photonics by integrating electronic
and photonic components on the interposer to enable wafer-scale
assembly," said Dr. Suresh Venkatesan, POET's Chairman and CEO. "We
are honored to work with an industry leader like FIT, capable of
ramping to high volume production with its expertise in transceiver
design and manufacturing. We look forward to expanding our
collaboration to future projects once this initial project is
complete."
POET's
transmit optical engines integrate externally modulated lasers
(EMLs), EML drivers, monitor photodiodes, optical waveguides,
thermistors and an optical multiplexer, where applicable, on to an
optical interposer-based PIC. The receive optical engines integrate
high-speed photodiodes, transimpedance amplifiers, optical
waveguides and optical demultiplexers, where applicable. All
components are passively assembled on the interposer at wafer scale
using standard pick-and-place semiconductor equipment. Passive
alignment of the photonic elements and use of high-speed RF traces
between the electronic and photonic components to avoid wire-bonds
are two hallmarks of the technology.
POET
expects to complete the design of the optical engines for FIT by Q3
2024 and start optical engine production at its joint venture,
Super Photonics Xiamen, by Q4 2024.
The
global optical transceiver market for 800G and 1.6T speed is
projected to grow at a CAGR of 33%, from $2.5 billion
in 2024 to $10.5 billion by 2029, according to Lightcounting Market
forecast.
To
view a YouTube video with further information, visit: https://youtu.be/qXBfL1l4b-k
About POET Technologies Inc.
POET
Technologies is a design and development company offering
integration solutions based on the POET Optical Interposer™, a
novel platform that allows the seamless integration of electronic
and photonic devices into a single multi-chip module using advanced
wafer-level semiconductor manufacturing techniques and packaging
methods. POET's
Optical Interposer eliminates costly components and labor-intensive
assembly, alignment, burn-in and testing methods employed in
conventional photonics. The cost-efficient integration scheme and
scalability of the POET Optical Interposer brings value to any
device or system that integrates electronics and photonics,
including some of the highest growth areas of computing, such as
Artificial Intelligence (AI), the Internet of Things (IoT),
autonomous vehicles and high-speed networking for cloud service
providers and data centers. POET is headquartered in Toronto, with
operations in Allentown, PA, Shenzhen, China and Singapore. More
information may be obtained at www.poet-technologies.com.
About Foxconn Interconnect Technology ("FIT"):
FIT
Hon Teng Limited (6088.HK) focuses on
precision design and manufacturing of connector products as its
core. FIT continues to explore 5G AIoT, EV mobility, and audio
applications areas, stepping into consumer brand operations. For
more information about FIT, please see: www.fit-foxconn.com
This news release contains
"forward-looking
information" (within the meaning of
applicable Canadian securities laws) and "forward-looking
statements" (within the meaning of the
U.S. Private Securities Litigation Reform Act of 1995). Such
statements or information are identified with words such as
"anticipate", "believe", "expect", "plan", "intend", "potential", "estimate", "propose", "project", "outlook", "foresee" or
similar words suggesting future outcomes or statements regarding
any potential outcome. Such statements include the
Company's
expectations with respect to market size, the capability,
functionality, performance and cost of the Company's
technology, the capabilities and expected success of its joint
venture, as well as the timing and inclusion of its technology in
customer's current and future products.
Such forward-looking information or
statements are based on a number of risks, uncertainties and
assumptions which may cause actual results or other expectations to
differ materially from those anticipated and which may prove to be
incorrect. Assumptions have been made regarding, among other
things, management's
expectations regarding the size of the market for its products, the
capability of its joint venture to produce products on time and at
the expected costs, the performance and availability of certain
components, and the success of its customers in achieving market
penetration for their products. Actual results could differ materially due
to a number of factors, including, without limitation, the
attractiveness of the Company's product offerings, performance of
its technology, the performance of key components, and ability of
its customers to sell their products into the
market. For
further information concerning these and other risks and
uncertainties, refer to the Company's filings on SEDAR+ at
www.SEDAR.com and on the website of the U.S. Securities and
Exchange Commission at www.sec.gov. Although the Company believes that the
expectations reflected in the forward-looking information or
statements are reasonable, prospective investors in the
Company's
securities should not place undue reliance on forward-looking
statements because the Company can provide no assurance that such
expectations will prove to be correct. Forward-looking information
and statements contained in this news release are as of the date of
this news release and the Company assumes no obligation to update
or revise this forward-looking information and statements except as
required by applicable securities laws.
Neither
TSX Venture Exchange nor its Regulation Services Provider (as that
term is defined in the policies of the TSX Venture Exchange)
accepts responsibility for the adequacy or accuracy of this
release.
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