Listing: TSX Venture Exchange
Symbol: DNX
First Customer Production Order
Received
LINCOLN, England, Jan. 10, 2018 /CNW/ - Dynex Power Inc. (TSXV:
DNX), a leading, high power semiconductor company, today announces
the formation of a new Semiconductor Foundry Services
business. This will form part of the portfolio led by
Mark Kempton, the company's Business
Unit Director for Semiconductor Devices.
As one of the industry leaders, Dynex has many years' experience
in the design and manufacture of IGBT die and Bipolar wafers, and
currently runs a state-of-the-art wafer fabrication facility in
Lincoln, England. Within the
last few months, Dynex has been offering its foundry services to
external semiconductor module companies, specifically focusing on
IGBT die in the range of 1.2kV to 6.5kV.
Dynex offers to the market a broad range of established, proven,
Trench Gate and DMOS die that form the basis of Dynex's own
high-quality IGBT modules. In addition, with its in-house
chip design team, Dynex can customise die to specific customer
requirements. This, coupled with full technical support,
world-class design capability, and rapid response to customer
needs, shows that Dynex is truly differentiated in the foundry
services arena.
Today, following the successful independent, external testing of
a range of Dynex die, the company is announcing the receipt of its
first production order for high-power IGBT die from a major
international semiconductor device manufacturer.
Commenting on the latest success in the growth of Dynex,
Mark Kempton, Business Unit Director
– Semiconductor Devices, said, "The formation of the Dynex Foundry
Services business is a logical expansion of the company's
commercial product and service offerings. The receipt of this
first external order for high voltage IGBT die builds on decades of
high-quality semiconductor fabrication experience at Dynex.
The excellent chip performance, confirmed by the customer's own
testing, serves to highlight the quality of our design and
manufacturing. We expect this business to grow into a
substantial part of our operations over the coming years as we
expand our customer base."
Clive Vacher, President and CEO,
added, "These are exciting times at Dynex. In 2017, we
released new, market-leading, high power IGBT modules – including
those incorporating the latest-generation Trench Gate technology –
as well as the pioneering Press-pack IGBT. At the same time,
we have refined our wafer fabrication processes to achieve
benchmark levels of quality, reliability and yields. We are
pleased now to be offering this technology and process robustness
to the wider semiconductor market."
Forward-looking Statements
In commenting on its
expectations, the Company cautioned existing and potential
shareholders about relying on the Company's expectations in that
the Company's expectations contain forward looking statements and
assumptions which are subject to the risks and uncertainties of the
markets and the future, which could cause actual results to differ
materially from expectations, and which are each difficult and
subjective to forecast. Certain of those risks and uncertainties
are discussed in the Management's Discussion and Analysis for the
quarter ended March 31st , 2016 and
include, among other things, risks and uncertainties relating to:
the level of worldwide demand for power semiconductors and power
semiconductor assemblies; the level of investment in power
electronic equipment, electrification of transport systems,
alternative power generation and high quality power transmission
and distribution; and fluctuations in exchange rates between
Canadian Dollars, Sterling, US dollars and Euros. As a consequence
of these and other risks and uncertainties, shareholders and
potential investors must make their own independent judgments about
the accuracy and reliability of the Company's expectations. Dynex
disclaims any intention or obligation to update or revise any
forward looking statement whether as a result of new information,
future events or otherwise.
About the Company
Dynex designs and
manufactures high power bipolar semiconductors, high power
insulated gate bipolar transistor (IGBT) modules and die, high
power electronic assemblies and radiation hard silicon-on-sapphire
integrated circuits (SOS IC's). The company's power products are
used worldwide in power electronic applications including electric
power transmission and distribution, renewable and distributed
energy, marine and rail traction motor drives, aerospace, electric
vehicles, industrial automation and controls and power supplies.
The Company's IC products are used in demanding applications in the
aerospace industry. Dynex Semiconductor Ltd is its only operating
business and is based in Lincoln,
England in a facility housing the fully integrated silicon
fabrication, assembly and test, sales, design and development
operations. In 2008, a majority of the shares of Dynex were
acquired by Zhuzhou CSR Times Electric Co., Ltd. In April 2016 this company changed its name to
Zhuzhou CRRC Times Electric Co., Ltd.
Zhuzhou CRRC Times Electric Co., Ltd. is based in Hunan Province in the People's Republic of China. It is listed
on the Hong Kong Stock Exchange. CRRC Times Electric is mainly
engaged in the research, development, manufacture and sales of
locomotive train power converters, control systems and other
train-borne electrical systems, as well as the development,
manufacturing and sales of urban railway train electrical systems.
In addition, CRRC Times Electric is also engaged in the design,
manufacturing and sales of electric components including power
semiconductor devices for the railway industry, urban railway
industry and non-railway purposes.
Press announcements and other information about Dynex are
available at www.dynexpower.com.
Further information on CRRC Times Electric can be found at
www.timeselectric.cn/en
All monetary values expressed in this release are in Canadian
Dollars unless stated otherwise.
The TSX Venture Exchange has neither approved nor disapproved of
the information in this press release.
SOURCE Dynex Power Inc.