WILSONVILLE, Ore., March 14, 2016 /PRNewswire/ -- Mentor
Graphics Corporation (NASDAQ: MENT) today announced a design,
layout, and verification solution to support design applications
for TSMC's Integrated Fan-Out (InFO) wafer-level packaging
technology. The solution comprises the Calibre® nmDRC
physical verification product, the Calibre RVE™ results viewing
platform, and the Xpedition® Package Integrator flow. It
enables mutual customers to deploy the unique fan-out layer
structures and interconnects in the TSMC InFO technology, targeting
cost-sensitive applications such as mobile and consumer
products.
![Mentor Graphics logo. Mentor Graphics logo.](http://photos.prnewswire.com/prnvar/20140317/AQ83812LOGO)
The interplay between today's advanced system-on-chip (SoC)
technologies and packaging requirements is driving the need for
co-validation between integrated circuit (IC) and package design
environments. The Xpedition Package Integrator flow will be
Mentor's platform to support TSMC's unique TSMC InFO design
requirements, including integration with other Mentor solutions—the
first being Calibre nmDRC and Calibre RVE.
The Mentor® solution allows IC and package designers
to view and cross-probe results from the Calibre nmDRC tool
directly inside the Xpedition Package Integrator flow for
verification of TSMC InFO interconnect structures. Because this
flow is based on proven integration via the Calibre RVE tool, it
results in automated sign-off verification and easier correction of
any issues highlighted by the Calibre nmDRC product. It also
streamlines the addition of future features and capabilities.
IC designers have widely adopted the Calibre nmDRC tool as their
sign-off solution for multiple process node generations. Through
the integration with Xpedition Package Integrator, they now share a
common view with package developers when performing
co-verification.
"We are focused on making our solutions easier for customers to
adopt by providing a design methodology that leverages proven EDA
design tools," said Suk Lee, TSMC
senior director, Design Infrastructure Marketing Division. "Mentor
and TSMC have established this InFO methodology through an
integration of the Calibre and Xpedition platforms, and will
continue to collaborate on enhancing that solution."
"Integrating Calibre nmDRC technology with the Xpedition Package
Integrator flow is a solid first step in Mentor's support of TSMC's
InFO technology," stated Joe
Sawicki, vice president and general manager of Mentor
Graphics Design to Silicon Division. "We continue to work with TSMC
and its ecosystem to expand beyond this initial step by
establishing a roadmap for additional capabilities to
further accelerate time-to-market for users of TSMC's InFO
offering."
About Mentor Graphics
Mentor Graphics Corporation
(NASDAQ: MENT) is a world leader in electronic hardware and
software design solutions, providing products, consulting services
and award-winning support for the world's most successful
electronic, semiconductor and systems companies. Established in
1981, the company reported revenues in the last fiscal year of
approximately $1.18 billion.
Corporate headquarters are located at 8005 S.W. Boeckman Road,
Wilsonville, Oregon 97070-7777.
World Wide Web site: http://www.mentor.com/.
For more
information, please contact:
|
David
Smith
Mentor
Graphics
503.685.1135
david_smith@mentor.com
|
|
(Mentor Graphics, Calibre and Xpedition are registered
trademarks, and RVE is a trademark, of Mentor Graphics Corporation.
All other company or product names are the registered trademarks or
trademarks of their respective owners.)
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SOURCE Mentor Graphics Corporation