WILSONVILLE, Ore., June 9, 2014 /PRNewswire/ -- Mentor Graphics
Corporation (NASDAQ: MENT) today announced its Xpedition™ Path
Finder product suite, providing designers with the ability to
assemble and optimize complex electronic systems, and thereby
enabling improved design, increased chip performance, and
cost efficiency. This product, the newest addition to the Mentor
Graphics® Xpedition platform, supports a methodology that leverages
layout data from the IC and board design teams to guide and
automate IC package selection and optimization.
![The Mentor Graphics Xpedition Path Finder Flow comprises all of the tools necessary for efficient IC/package/PCB co-design, for a single product, or for incorporating into multiple form factors with different physical constraints. The Mentor Graphics Xpedition Path Finder Flow comprises all of the tools necessary for efficient IC/package/PCB co-design, for a single product, or for incorporating into multiple form factors with different physical constraints.](http://photos.prnewswire.com/prnvar/20140606/95781)
The Xpedition Path Finder suite provides a single environment
that gives cross-domain design teams the ability to model every
device/interface to the level of detail and accuracy they require.
IC layout design data can be represented as a virtual die model
(VDM), containing all of the IC-level detail specific to the
co-design and optimization process. Board design data can be
modelled as individual interfaces or as complete designs. Packages
can be built based on industry-leading pin array generation and
manipulation capabilities, existing devices, and industry-standard
formats. Cross-domain design teams can now make smart planning and
optimization decisions related to cost and performance of their IC
package in context of the complete system.
"Mentor's Xpedition Path Finder technology provides unique
capabilities not found elsewhere, which is important for our
business as a design services partner for major semiconductor
companies," said Farhang Yazdani,
president and chief technical officer of BroadPak. "We're realizing
substantial time and cost savings using Path Finder, while
improving the overall quality and performance of the package
designs."
Developed to Address Today's Systems Design
Complexity
The Xpedition Path Finder suite addresses the increasing design
complexity of system on chip (SoCs) and multi-die packaging growth
by providing the industry's first new path-finding methodology that
automates the planning, optimization, and connectivity from a chip
through multiple packaging variables, while targeting multiple and
different PCB platforms.
Using the multi-mode connectivity environment, designers can
capture and manage connectivity based on their preference;
table-based, graphical schematics or automated. Cross-domain pin
mapping and net combining can easily be managed in all modes of
connectivity capture. In addition, users can perform rules-based
pin/ball-out studies from their respective domains, by signal, bus
or interface, visualizing the impact across the complete system in
real time. Path Finder also streamlines and automates the library
development process, reducing a several day task down to a few
minutes.
"The exponential increase in electrical systems design
complexity is motivating Mentor to deliver solutions to the
marketplace that address new design and manufacturing challenges,"
stated Henry Potts, general manager
and senior vice president of Mentor Graphics Systems Design
Division. "We are very excited by the customer feedback we have
received on our Path Finder technology and we are looking forward
to wider deployment, enabling designers to achieve optimum
productivity."
Xpedition Path Finder – The Comprehensive Solution for
Package Path Finding
The Xpedition Path Finder suite is comprised of a multi-mode
connectivity engine and optimization engine/editor, leveraging a
physical layout tool with industry-leading routing technology.
Unique and specialized features in the Path Finder suite
include:
- A correct-by-construction layout environment that enables
designers to optimize performance and manufacturability on the
densest designs populated by high-pin-count flip-chip
BGAs. The core Xpedition layout tool provides: unique BGA
breakout and escape algorithms coupled with support for complex
microvia structures; shape-based, any-angle routing; plane areas
that dynamically fill around traces and vias during editing;
patented technology enabling efficient, concurrent design by large
teams; and integrated RF circuit design and optimization
- Rule-based ball-out assignment, including an optimization
engine/editor for planning by bank, byte, reference voltage, clock
domain, etc. – an intelligent way to show a ball map: simply
create, import, and export
- Single tool for multi-mode physical design (PCB, MCM, SiP, RF,
Hybrid and BGA designs) that reduces design time orders of
magnitude compared to other available products – using
Microsoft-based Component Object Model (COM) automation for robust
extension and customization capabilities
- Streamlined and fully automated library development
- Virtual Die Model (VDM) to accurately capture IC layout (floor
planning) design intent, facilitating WYSIWYG IC and package
co-optimization.
- Tight integration with 2D and 3D electro-magnetic (EM) and
computational fluid dynamics (CFD) thermal analysis engines
Xpedition Path Finder Product Availability
The Xpedition Path Finder suite is available today and is an EDA
vendor-neutral flow. The product leverages other Mentor
Graphics tools such as the HyperLynx® signal and power integrity
product, and 3D full-wave EM analysis tools, Xpedition layout
technology, the FloTHERM® CFD thermal modelling tool,
visECAD®/CAMCAD design comparison tool, and Valor® NPI substrate
fabrication checking tool. For product pricing, consult your
Mentor Graphics sales representative or call 1-800-547-3000. For
additional product information, visit the website:
http://www.mentor.com/pcb/path-finder/overview
About Mentor Graphics
Mentor Graphics Corporation (NASDAQ: MENT) is a world leader in
electronic hardware and software design solutions, providing
products, consulting services and award-winning support for the
world's most successful electronics and semiconductor companies.
Established in 1981, the company reported revenues over the last 12
months in excess of $1.15 billion.
Corporate headquarters are located at 8005 S.W. Boeckman Road,
Wilsonville, Oregon 97070-7777.
World Wide Web site: http://www.mentor.com/.
(Mentor Graphics, HyperLynx, FloTHERM, visECAD and Valor are
registered trademarks and Xpedition is a trademark of Mentor
Graphics Corporation. All other company or product names are the
registered trademarks or trademarks of their respective
owners.)
For more information, please
contact:
Larry
Toda
Mentor Mentor
Graphics
503.685.1664
larry_toda@mentor.com
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Logo -
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SOURCE Mentor Graphics Corporation