Mentor and Tezzaron Optimize Calibre 3DSTACK for 2.5/3D-ICs
20 5월 2013 - 10:00PM
Business Wire
Mentor Graphics Corp. (NASDAQ: MENT) and Tezzaron Semiconductor
Corp. today announced they are collaborating to integrate the
Mentor® Calibre® 3DSTACK product into Tezzaron’s 3D-IC offerings.
The new integration will focus on fast, automated verification of
die-to-die interactions in 2.5D and 3D stacked die configurations
by verifying individual dies in the usual manner, while verifying
die-to-die interfaces in a separate procedure with specialized
automation features. The two companies plan to extend their
collaboration to include development of solutions for the silicon
photonics market.
“Tezzaron specializes in 3D wafer stacking and TSV processes. We
work with dozens of customers to create custom 3D-ICs for
prototyping and commercialization, including recent 3D-ICs in 40 nm
and 65 nm, the first at these small nodes,” said Robert Patti, CTO
and VP of design engineering at Tezzaron Semiconductor. “By
collaborating with Mentor Graphics, we can offer our mutual
customers a comprehensive design verification solution. It creates
the highest value for them with the least disruption to their
existing flows. Using Calibre, our customers get the best possible
turnaround time. Even better, there is no need to generate a
‘Frankenstein’ GDS file combining all the individual dies in a
3D-IC assembly, and no need to deal with a ‘monster’ rule file
combining different die processes. Calibre makes the process very
fast and relatively easy.”
Tezzaron works with industry, academia, and government to create
advanced 3D-ICs. Their offerings include wafer stacking and die
stacking technology with TSVs, Bi-STAR® built in self-test and
repair circuitry for continuous error detection and recovery, and
extremely fast memory devices for both standalone and stacked
applications.
Complementing Tezzaron’s 3D-IC design capabilities, the Calibre
3DSTACK signoff solution provides DRC, LVS, and parasitic
extraction (PEX) capabilities. It verifies physical offset,
rotation, and scaling at the die interfaces. It also enables
connectivity tracing and extraction of interface parasitic elements
needed for multi-die performance simulation. The Calibre 3DSTACK
product is a fully compatible extension to the standard Calibre
signoff platform, so it can be easily added to existing
verification flows to support flexible stacking configurations of
multiple dies, including dies based on different technologies or
process nodes.
“Over the last two years, the relationship between Mentor
Graphics and Tezzaron has really blossomed as we work together to
bring volume 3D-IC applications to the IC industry mainstream,”
said Michael Buehler-Garcia, senior director of marketing for
Calibre Design Solutions at Mentor Graphics. “Combining
flexibility, ease-of-use, and interoperability provides the highest
value for our mutual customers, and will help make the adoption of
3D-IC design techniques successful.”
About Tezzaron
Tezzaron Semiconductor Corporation is a world leader in the
design and production of 3D-ICs built with through-silicon vias
(TSVs). Tezzaron also builds patented ultra-high-speed memory
products. Tezzaron’s products and technologies have applications in
defense, super-computing, high speed telecommunications, and
anywhere that speed, reliability, and power optimization are
needed. Corporate headquarters are located at 1415 Bond Street,
Suite 111, Naperville, Illinois 60563. World Wide Web site:
http://www.tezzaron.com/.
About Mentor Graphics
Mentor Graphics Corporation is a world leader in electronic
hardware and software design solutions, providing products,
consulting services and award-winning support for the world’s most
successful electronic, semiconductor and systems companies.
Established in 1981, the company reported revenues in the last
fiscal year of about $1,090 million. Corporate headquarters are
located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777.
World Wide Web site: http://www.mentor.com/.
(Mentor Graphics, Mentor, and Calibre are registered trademarks
of Mentor Graphics Corporation. Tezzaron and Bi-STAR are registered
trademarks of Tezzaron Semiconductor. All other company or product
names are the registered trademarks or trademarks of their
respective owners.)
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