Mentor Graphics’ Calibre SmartFill Addresses TSMC 20nm Fill Requirements
30 5월 2012 - 10:00PM
Business Wire
Mentor Graphics Corporation (NASDAQ: MENT) today announced TSMC
will use the Calibre® SmartFill solution to achieve TSMC’s fill
requirements for its 20nm manufacturing processes. SmartFill
analysis and automatic filling capabilities in the Calibre
YieldEnhancer product address new 20nm fill requirements that
cannot be achieved with traditional dummy fill approaches. The
Calibre SmartFill solution delivers smaller post-fill GDS database
size and faster runtimes, allowing designers to meet IC fill
constraints in a single pass without manual customization or
modification, and with minimal impact on circuit performance.
New Capabilities for Advanced Fill Requirements
The move to more advanced nodes has pushed fill requirements
beyond traditional fill approaches. In addition to improving
planarity, fill now needs to handle CMP-ECD, etch, lithography,
stress and rapid thermal annealing (RTA). A more advanced solution
must deal with those effects concurrently and still provide ease of
use and design flow integration.
The SmartFill capability in the Calibre YieldEnhancer product
provides advanced capabilities such as multi-layer fill shapes and
user-defined fill cells that are automatically inserted into a
layout based on analysis of the design. It also supports
continuous, multi-dimensional functions in place of linear
pass-fail conditions, enabling finer resolution of complex fill
algorithms that cannot be performed with single-dimensional design
rules alone. This allows customers to simultaneously optimize for
multiple factors such as density and perimeter.
The SmartFill solution fits into the customer’s existing design
environment with back annotation of fill shapes into all leading
design databases to support final timing verification. It also
allows customers to define a list of critical nets that require
special treatment during the fill procedure.
“Adding fill to advanced IC layouts is about much more than just
controlling planarity in manufacturing,” said Jean-Marie Brunet,
director of product marketing for Calibre DFM and Place-and-Route
Integration at Mentor Graphics. “Calibre SmartFill gives designers
a fast and automated solution that creates the precise amount,
shape and location of fill, not only to ensure that layouts meet
complex manufacturing requirements, but also to maintain design
intent.”
“We continue to work with Mentor to meet new fill challenges as
we move to each successive process node,” said Suk Lee, TSMC senior
director, Design Infrastructure Marketing Division. “At 20nm an
effective fill strategy is important for successful manufacturing.
Calibre’s integrated fill analysis and cell-based approach makes
fill more precise and makes writing fill decks easier, while
achieving target runtime and output file size.”
About Mentor Graphics
Mentor Graphics Corporation is a world leader in electronic
hardware and software design solutions, providing products,
consulting services and award-winning support for the world’s most
successful electronic, semiconductor and systems companies.
Established in 1981, the company reported revenues in the last
fiscal year of about $1,015 million. Corporate headquarters are
located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777.
World Wide Web site: http://www.mentor.com.
(Mentor Graphics and Calibre are registered trademarks of Mentor
Graphics Corporation. All other company or product names are the
registered trademarks or trademarks of their respective
owners.)
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