Mentor Graphics Announces Industry’s First Integrated Solution for Component-to-System Thermal Characterization and Analysis
12 12월 2011 - 11:00PM
Business Wire
Mentor Graphics Corporation (NASDAQ: MENT) today announced the
electronic industry’s first combined technology for thermal
characterization and simulation with T3Ster® hardware test products
and its FloTHERM® software. The Mentor Graphics® T3Ster product is
the world’s leading advanced thermal transient tester for
semiconductor device packages and LEDs. Mentor’s FloTHERM product
is the de-facto standard for electronics thermal simulation and
analysis to predict airflow, temperature and heat transfer
throughout electronics equipment including components, boards, and
entire systems. The unique interface between T3Ster and FloTHERM
seamlessly creates accurate thermal simulation models. The thermal
characterization offering is unique because it is the only
JESD51-14 compliant solution available on the market today.
Increased design complexity and smaller form factors create heat
management problems which represent one of the biggest challenges
in electronics today. Temperature is understood to be the key
accelerator in the majority of reliability failures and IEEE
Standard 1413 recognizes the need for accurate thermal data at all
levels of a system’s implementation.
Designers working on subsystems and systems using information
for LED, semiconductor, and package components use complex thermal
analysis software to help accelerate the design of their products
but the analysis, typically based on vendor datasheets, often
provides insufficient results. Clear, accessible, and reliable data
relating to thermal characteristics upstream and downstream is
critical. Methods to achieve this have traditionally been awkward,
manual and therefore error-prone – until now with Mentor Graphics
T3Ster thermal characterization and interface to the FloTHERM
thermal simulation software product.
Now the integration of Mentor’s T3Ster hardware measurement and
FloTHERM software simulation provides a combined methodology of
optimizing heat management in devices, sub-systems and full
systems. Manufacturers are able to optimize their LED and IC
package designs for effective heat dissipation. Once the device
prototype is built, they can then characterize the device from a
thermal perspective and build accurate models for use in FloTHERM
thermal software simulations at both the sub-system and full system
levels. Finally, systems integrators can further verify their heat
management solutions with physical measurements using the T3Ster
hardware.
“As LEDs become more powerful, more attention should be paid to
thermal management, which is essential to ensure stable LED
performance and long lifetime. This is why OSRAM is devoting
considerable attention to thermal design. T3Ster’s accuracy and
repeatability enable us to verify our thermal designs and confirm
the stability and reliability of our products,” stated Dr. Thomas
Zahner, quality manager, Osram Opto Semiconductors. “By testing in
bulk we get increased statistical confidence in the measurement
results. The structure functions built into the T3Ster software are
extremely powerful for identifying different thermal attach issues
during our extensive reliability testing.” (from “When Designing
with Power LEDs, Consider Their Real Time Thermal Resistance,” by
Andras Poppas, Mentor Graphics, Nov/Dec 2009 LED Professional
Review.)
“To design our lighting systems, we needed reliable data
regarding LED characteristics and simulation tools which deliver
results quickly. We found that Mentor’s T3Ster and FloTHERM
products were the best such tools available to us and we could use
them in our project to verify our PearLight street lighting
luminaires for proper heat management. Accuracy and speed in
achieving the results was critical for our business,” said András
Szalai, CFO, HungaroLux.
JEDEC is the organization dedicated to microelectronics industry
standards. The Mentor Graphics T3Ster advanced thermal
characterization tester for semiconductor packages is the only
commercially available product to fully implement the JEDEC
JESD51-14 new measurement methodology standard for the
junction-to-case thermal resistance of power semiconductor devices.
The T3Ster test methodology ensures higher accuracy and
repeatability compared to classical steady-state measurements based
on older standards.
Mentor’s FloTHERM product allows engineers to implement virtual
prototypes using advanced CFD techniques to simulate airflow,
temperature and heat transfer in electronic systems. By using
accurate thermal analysis, engineers can evaluate and test designs
automatically before physical prototypes are built. When combined
with the T3Ster product, engineers using the FloTHERM tool will
benefit from both accurate thermal simulation models derived from
real measurements and thermal package characterization testing.
Package characterization measurements provide an insight into
the package structure with thermal resistances and thermal
capacitances. Simulation software provides the engineer with
information on specific sections of the design that correspond to
the measured structure. Thermal interface materials are quite
difficult to model since their conductivity and thickness cannot be
determined with high accuracy. Thus, thermal package measurements
produced by the T3Ster product, based on the resistance of these
materials, can be used later for accurate model creation in
FloTHERM software. This seamless process provides fast, easy and
accurate model creation; identifies product design defects; and
enables manufacturing quality checking. The combined T3Ster tester
and FloTHERM analysis software solution is compatible with other
Mentor Graphics products to provide comprehensive thermal
simulation for optimum system reliability, from IC package and LED,
to PCB, and to full system development.
“Mentor’s best-in-class thermal simulation and measurement of
semiconductor packages and LEDs provide tremendous advantages for
customers faced with thermal challenges,” said Erich Buergel,
general manager of Mentor Graphics Mechanical Analysis Division.
“The ease in creating accurate thermal models based on reliable
thermal measurements helps users quickly to identify design
problems and to create design alternatives which improve product
quality, reliability, and increased profitability.”
Product Availability and Additional Information
The Mentor Graphics T3Ster and FloTHERM solution for efficient
thermal package characterization is available today. For more
information on FloTHERM and T3Ster technologies, and other products
from Mentor’s Mechanical Analysis Division, visit the company
website at www.mentor.com/mechanical.
About Mentor Graphics
Mentor Graphics Corporation (NASDAQ: MENT) is a world leader in
electronic hardware and software design solutions, providing
products, consulting services and award-winning support for the
world’s most successful electronic, semiconductor and systems
companies. Established in 1981, the company reported revenues in
the last fiscal year of about $915 million. Corporate headquarters
are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon
97070-7777. World Wide Web site: http://www.mentor.com/.
(Mentor Graphics, T3Ster and FloTHERM are
registered trademarks of Mentor Graphics Corporation. All other
company or product names are the registered trademarks or
trademarks of their respective owners.)
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