Mentor Graphics Works with Tezzaron and MOSIS on 3D-IC Prototyping Service
03 6월 2011 - 10:00PM
Business Wire
Mentor Graphics Corporation (NASDAQ: MENT) today announced a
cooperative effort with Tezzaron Semiconductor and MOSIS to provide
IC designers with a way to economically develop and manufacture
3D-IC prototypes on multi-project wafers (MPWs). The process
enables designs using tens of millions of through silicon vias
(TSVs) with dimensions as small as 1.2 x 6 microns and a pitch of
2.4 microns, producing up to 300,000 vertical interconnects per
square millimeter.
“Our collaboration allows firms to explore practical
applications of true 3D-IC integration in a way that reduces risk
and cost, while taking advantage of over a decade of experience in
manufacturing 3D-ICs with high density TSVs,” said Robert Patti,
CTO of Tezzaron Semiconductor.
“Adding Tezzaron’s offering to our Multi Project Wafer (MPW)
services allows companies to test out 3D-IC concepts using the same
provider and model they currently use for their standard
semiconductors,” said Wes Hansford, director at MOSIS. “By
coordinating resources and schedules, we can significantly reduce
the effort and risk involved in getting the silicon-proven data
required to make effective product roadmap decisions.”
“We’re working with Tezzaron and MOSIS to ensure that even at
the prototype stage our customers will be able to access
production-certified Calibre solutions to verify that their 3D-IC
designs are manufacturable,” said Joseph Sawicki, vice president
and general manager of the Design-to-Silicon Division at Mentor
Graphics. “The Calibre solution uses foundry-certified PDKs from
MOSIS wafer suppliers with extensions for MOSIS-Tezzaron 3D-IC
designs.”
Customers can use the 3D-IC service to create proof-of-concept
ICs that demonstrate the use of high-density TSVs in stacked die
configurations for intelligent sensor, multi-core processor and
many other applications. MOSIS manages MPW projects including
reticle creation, fab reservations, final packaging and testing,
and other logistics. Tezzaron enhances customer designs as required
for successful 3D-IC integration and also provides backend
manufacturing steps including wafer thinning, backside metal and
wafer bonding. Mentor provides DRC and LVS tools that support 3D-IC
physical verification, ensuring that designs are correct and will
meet 3D process requirements.
For more information about the 3D-IC prototyping service, please
go to the MOSIS web site at www.mosis.com.
About Tezzaron
Tezzaron® Semiconductor specializes in 3D wafer stacking, TSV
processes, and cutting-edge memory products. In 2004, Tezzaron
demonstrated the world’s first successful 3D-ICs with TSV,
including microprocessors, sensors, and SRAM devices. Tezzaron was
founded in 1999 and maintains its headquarters at 1415 Bond Street,
Suite 111, Naperville, IL 60563 (www.tezzaron.com).
About MOSIS
MOSIS is a low-cost prototyping and small-volume production
service for VLSI circuit development. Since 1981, MOSIS has
fabricated more than 50,000 circuit designs for commercial firms,
government agencies, and research and educational institutions
around the world.
About Mentor Graphics
Mentor Graphics Corporation (NASDAQ: MENT) is a world leader in
electronic hardware and software design solutions, providing
products, consulting services and award-winning support for the
world’s most successful electronic, semiconductor and systems
companies. Established in 1981, the company reported revenues over
the last 12 months of about $915 million. Corporate headquarters
are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon
97070-7777. World Wide Web site: http://www.mentor.com/.
(Mentor Graphics and Calibre are registered trademarks of Mentor
Graphics Corporation. All other company or product names are the
registered trademarks or trademarks of their respective
owners.)
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